IC755CSS15CDA | GE Fanuc | operator interface

Primarily used for cosmetic purposes, the empty IC694ACC310 module is a placeholder or filler on the GE RX3i PacSystem’s rack-based system. Multiple blank slot filler modules can be used on a single rack to make a complete rack of modules. The filler module can be used to protect active modules from damage and to keep active modules from moving out of place on the rack in the event of a hit or fall.

By filling the empty slot on the rack, the IC694ACC310 can protect the slot from damage if a liquid slash or spill occurs on the rack. If a single slot module was damaged, the electronics of the damaged module can be removed from its case and placed in the IC694ACC310 to resume full operation.

Other modules included in the GE RX3i PacSystem are Temperature Control Modules, Thermocouple, I/O Modules, Resistive I/O Module, Expansion Modules for local and remote I/O, Pneumatic Module, Power Measurement Modules, Co-Processor Communications Modules, Serial Communications Modules, Strain Gage I/O Modules, RTD I/O Modules, Millivolt I/O Modules, Analog Mixed I/O Modules (Input and Output), Discrete I/O Modules, and Reflective Memory Interface Modules for personal computing systems. 

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